Signolux ultrashort pulse laser (UKP) for ultra-fine drill holes

Laser drilling with ultrashort pulse lasers (Signolux picosecond or femtosecond lasers) enables absolutely precise, virtually burr-free processing of the most sensitive materials - even for micro holes in the single-digit micrometre range. Due to the extremely short pulse durations in the range of trillionths or quadrillionths of a second, material ablation is carried out "cold", i.e. without any significant heat development. As a result, the surrounding material is hardly affected - a decisive advantage for thermally sensitive materials or when the highest structural quality is required.

Flexible and economical

Process reliability

Precise

Fast

Laser drilling using the roll-to-roll process (Roll to Roll-R2R)

Laser drilling using the roll-to-roll process (R2R) enables continuous, high-precision processing of flexible web materials - ideal for applications with high quantities and tight tolerances. In combination with fast galvo systems, micro holes with high repeat accuracy and freely selectable geometry can be produced inline and with continuous material feed. This allows perforations, screen structures or functional hole patterns to be realised efficiently and economically - without mechanical wear or set-up times.typical materials in the R2R laser drilling process are polymer films (e.g. PET, PI, PE), metal foils (e.g. copper, stainless steel) or laminated and coated substrates. The process is used in areas such as electronics production, filter technology, medical technology, battery production and the packaging industry, etc. The major advantage: thanks to the combination of precise beam guidance, continuous material movement and process monitoring, R2R laser drilling offers maximum productivity with consistent quality - even with complex patterns and the finest hole diameters in the micrometre range.

How many holes do you produce?

Laser drilling using an electroforming system is ideal for a wide range of demanding applications where maximum precision, minimum thermal stress and fast processing are required. Typical areas of application include electronics production, where the finest micro-drilling is required in printed circuit boards, flexible substrates or foils for sensors and microelectronics. The process is also used in medical technology, for example to produce micro sieves, filter foils or nozzle plates for spray and nebuliser systems. In microfluidics, the technology enables the precise perforation of plastic or glass structures, for example for lab-on-a-chip systems. Other applications include the perforation of technical films for the packaging and food industries as well as the selective drilling of functional surfaces in automotive or energy technology. Suitable materials for laser drilling with galvanometer scanners include thin metal foils such as stainless steel, copper or aluminium, but also technical plastics such as polyimide (PI), polyethylene terephthalate (PET) or polymethyl methacrylate (PMMA). In addition, brittle materials such as thin glass, ceramics or semiconductors such as silicon can also be processed with precision. The decisive factor here is the combination of material-adapted laser selection and precise beam guidance by the galvo system, which enables burr-free, sharply contoured drilling even with complex geometries.

Are you planning a project?

We support you from the initial idea through to series production - including design consulting, prototyping and system integration.